voice search
Gold Osp 6 Layers Mobile Phone Circuit Board Board Thickness: 0.1-5 Millimeter (Mm)
Share

Gold Osp 6 Layers Mobile Phone Circuit Board Board Thickness: 0.1-5 Millimeter (Mm)

Price: 1 USD ($)

Get Latest Price

Minimum Order Quantity :

1

In Stock

In Stock

Product Specifications

Board Thickness0.1-5 Millimeter (mm)
Surface FinishOSP
Product TypeGold OSP 6 Layers Mobile Phone Circuit Board
ColorGreen
Min. Line Width0.075/3mil Millimeter (mm)
Delivery Time30 Days
Packaging DetailsCustomer settings
Main Export Market(s)Asia, North America, Australia, South America, Eastern Europe, Western Europe, Central America
Payment TermsPaypal, Cash in Advance (CID), Others, Cash on Delivery (COD), Cash Advance (CA), Telegraphic Transfer (T/T), Cash Against Delivery (CAD), Letter of Credit at Sight (Sight L/C)
FOB Portshenzhen
Supply Ability80,000 Per Week
GSTIN0%

Product Overview

Key Features

Details of Gold OSP 6 Layers Mobile Phone Circuit Board. Specification: 1)A Minimum gapi 0.065/2.8mil 2)A Minimum apertureA inradiumi 0.15mm 3)A Minimum aperture external diameteri 0.45mm 4)A Minimum BGA: 0.2mm 5)A Layeri 4 layers through hole non-impedanceA All multi-layer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the BGA and more precise fine lines.

Related Products

More Product From This seller

Company Details

HK CT TECH CO.,LIMITED(Shenzhen Shengxu Electronics Technology Co.,Ltd.) is a manufacturer who provides pcb proofing and production, pcba manufacturing and materials purchasing, finished products assembly and production of one-stop service for global customers. CTT committed to provide first-class services for global enterprises, to create business value for our customers. Our company is located in Shenzhen Shiyan Tangtou Hongfa Technology Park, pcba processing plant area 2500 m2A A A A A A employees more than 150 people. Owns the smt machine room, the automatic flowing plug-in lines, the wave- soldering, the automatic constant temperature tin holding tools, average daily capacity of 400000 units dip plug-in ability; Total 4 assembly line, more than 3 million points per working day processing capacity which can adapt to large, medium and small equipment products assembly; With bga mounting technology and repair technology, with 100 square meters of high temperature aging room, ultrasonic cleaning room, complete anti-static production measures, dust-free production workshop. The PCB production plant area is 5000 m2A A A A A A which can produce 20 layers multilayer PCB.The minimum aperture could be 0.15mm, minimum linewidth / gap 2.8mil. The average monthly output is 8000 square meters and the average monthly sample is 1500 models. Our main business is pcb proofing and production, smt processing, patch processing, plug-in processing, post welding processing, template welding, bga mounting, bga rework, bga bead planting, testing, finished product assembly, finished product aging, finished product packaging.

Business Type

Exporter, Manufacturer

Employee Count

200

Establishment

2008

Working Days

Monday To Sunday

Explore Related Categories

Seller Details

Shenzhen, Guangdong

Mr Edward

Address

5th Floor, Building F, Hongfa Technology Industrial Park, Tangtou Community, Shiyan Street, Baoan District, Shenzhen, Guangdong, 518000, China

electronic circuit boards in Shenzhen

Report incorrect details

Compare With Similar Products

Minimum Order Quantity

1 Square Meter/Square Meters

10 Unit/Units

10 Unit/Units

Price Or Price Range

1 USD

1450 INR

1450 INR

Product Type

Gold OSP 6 Layers Mobile Phone Circuit Board

Circuit

Circuit

Delivery Time

30 Days

5 Days

5 Days

Payment Terms

Paypal

Cheque

Cheque

Main Domestic Market

All India

All India

Sample Available

Yes

Yes

Sample Policy

Contact us for information regarding our sample policy

Contact us for information regarding our sample policy

Sold By

Trixtek
Tamluk, West Bengal

Trixtek
Tamluk, West Bengal