
Gold Osp 0.2mm Thickness Pcb Seamless Splicing
Price: 1 USD
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Minimum Order Quantity :
1
In Stock
Product Specifications
Thickness | 0.1mm-5mm |
Linewidth | 0.075mm/3mil |
Gap | 0.065/2.8mil |
Aperture inradium | 0.15mm |
Aperture diameter | 0.45mm |
Minimum BGA | 0.2mm |
Layers | 4 layers |
Features | Seamless splicing, High precision, Thin profile, Reliable BGA, Fine lines, Durable, Multilayer PCB |
FOB Port | SHENZHEN |
Payment Terms | Letter of Credit at Sight (Sight L/C), Paypal, Telegraphic Transfer (T/T) |
Supply Ability | 80000 Per Week |
Delivery Time | 30 Days |
Packaging Details | Customer settings |
Main Export Market(s) | North America, South America, Eastern Europe, Middle East, Western Europe, Central America, Asia, Australia |
Product Overview
Key Features
Gold OSP 0.2mm thickness PCB seamless splicing
Multilayer PCB, seamless splicing PCB
1)A Thickness: 0.1mm-5mm
2)A Minimum linewidthi 0.075mm/3mil
3)A Minimum gapi 0.065/2.8mil
4)A Minimum apertureA inradiumi 0.15mm
5)A Minimum aperture external diameteri 0.45mm
6)A Minimum BGA: 0.2mm
7)A Layeri 4 layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
Company Details
Business Type
Exporter, Manufacturer
Employee Count
200
Establishment
2008
Working Days
Monday To Sunday
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Seller Details
Shenzhen, Guangdong
Mr Edward
Address
5th Floor, Building F, Hongfa Technology Industrial Park, Tangtou Community, Shiyan Street, Baoan District, Shenzhen, Guangdong, 518000, China
multilayer pcb in Shenzhen
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