Potato Wafer Plant

Potato Wafers are made by cutting potatoes into thin slices. To reduce the starch content from the potato slices they are washed in cold water and hot water. The slices are then rapidly dehydrated to reduce the moisture content and then are fried in cooking oil. Excess oil is extracted and fried potato wafers are seasoned with salt and other spices as per the requirement and then packed in pouches using suitable packing machine.

Machines Involved in making Potato Wafers:
a)LS-01 : Potato Peeling Machine : To wash and peel the potatoes for making potato wafers

b)LS- 06 : Potato Slicing Machine : To slice the potatoes into thin slices for making potato wafers as per required type and thickness. It is possible to make different types by simply changing the cutting knife of the machine

c)LS-23 : Water De-Hydrator Machine : To reduce the moisture content from the potato slices so that they get easily fried in the frying machine

d)LS-31 : Frying Pan with Burner : To fry the potato slices in hot cooking oil

e)LS-26 : Oil-Extractor Machine : To extract the excess oil from the Potato Wafers before packing

f)LS-41 : Semi-Automatic Seasoning Machine : To add oil and required seasoning to the fried Potato Wafers to improve their taste

g)LX-55 : Automatic pouch Packing Machine : To pack the Potato Wafers into attractive printed pouches with gas flushing

Available Plant with output capacity per 8 hour shift: 150 kg, 300 kg, 500 kg, 1 ton