Ndt X Ray Inspection Machine For Smt Mobile Phone Darkness Range: 2

Backed by a team of diligent experts, we have been able to manufacture, export and distribute a wide range of NDT X Ray Inspection Machine For SMT Mobile Phone in Shenzhen, Guangdong, China. Seamark ZM provides products and services through a network of technology sales reps and distributors. We can offer a full line of Inspection, Rework & Repair Solution for Electronics, Including Inline/off line X-Ray Inspection System, BGA Rework System, Laser LCD Repair System, Reflow Oven, Conveyor, Solder Printer, Glue Dispenser, Fume Extraction System, Mobile LCD Repair Machine. Our aim is to provide clients with the most valuable and innovative testing solutions at effective cost. High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free 2.3 mllion high resolution digital flat panel detector 6 axis linkage system. 60 degrees observation Platform 360A rotation Color lmage Navigation & Mapping Navigation Full Automatic BGA Detecting Procedures Simple mouse click programming ,automatically detects the components of each BGA without the need for operator intervention Automatic IC Semiconductor detect, accurately check the bridge, welding, cold welding and void ratio of BGA. Automatic IC Semiconductor detect ,repeatable detect results in order to process control Detect results will be displayed on the screen and can be output to Excel to facilitate review and archiving Mapping Mosaic Function.(optional ) Scalable 3D module(industrial CT) (optional) Programmable Detection.(optional ) 7600 X ray Equipment video-how to detect Application: 1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity. 2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components. 3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open. 4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement. 5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors. 6) Inner rupture or hollow inspection in plastic or metal. 7) Battery stacking uniformity, electrode welding inspection. 8) Seed, biological material inspection etc. Applications: LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing components Battery Industry Electronic components, Auto parts, Photovoltaic Industry Aluminum Die Casting, Moulding Plastic Ceramics, Other special Industries Related Article: x ray knowledge Non-destructive testing DR X-Ray imaging