X-ray Inspection System - 5200*6588*2525mm | High-definition 3d Module, Automatic Bga Detecting Procedures, Non-destructive Testing

Keeping in mind ever-evolving requirements of our respected clients, we are manufacturing, exporting and distributing a premium quality range of X-Ray Inspection System For SMT/Semicon/Solar/Conn/Led High-Definition in Shenzhen, Guangdong, China.

X-Ray inspection system X7800 X ray x-ray inspection system machine equipment X 6600 for SMT SMD BGA LED PCB semiconductor battery casting ceramic connectors

High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
90KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free
2.3 mllion high resolution digital flat panel detector
6 axis linkage system.
60 degrees observation
Platform 360A rotation
Color lmage Navigation & Mapping Navigation
Full Automatic BGA Detecting Procedures
Simple mouse click programming ,automatically detects the components of each BGA without the need for operator intervention
Automatic IC Semiconductor detect, accurately check the bridge, welding, cold welding and void ratio of BGA.
Automatic IC Semiconductor detect ,repeatable detect results in order to process control
Detect results will be displayed on the screen and can be output to Excel to facilitate review and archiving
Mapping Mosaic Function.(optional )
Scalable 3D module(industrial CT) (optional)
Programmable Detection.(optional )
Youtube: 7600 X ray Equipment video-how to detect

Application:

1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.

2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.

3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.

4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.

5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.

6) Inner rupture or hollow inspection in plastic or metal.

7) Battery stacking uniformity, electrode welding inspection.

8) Seed, biological material inspection etc.

Applications:

LED, SMT, BGA, CSP, Flip Chip Inspection

Semiconductor, Packing components

Battery Industry

Electronic components, Auto parts, Photovoltaic Industry

Aluminum Die Casting, Moulding Plastic

Ceramics, Other special Industries

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