Mechanic Intelligent Desoldering Reflow Degumming Tin Planting Platform Weight: 1.35kg Kilograms (Kg)

Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform with 3.4 inch Screen Display for Phone 11 to 13Pro Max Motherboard Repair, Intelligent Desoldering Reflow Degumming Layering Lamination Tin Planting Welding Mobile Phone Curve Heating Tool. Features: 1. Intelligent Desoldering, Reflow, Degumming, Layering, Lamination, Tin Planting, Welding Mobile Phone Curve Heating Tool. 1. 3.4inch Screen Display Monitor temperature changes and realize reflow soldering temperature curve data monitoring. 2. Turbofan blades for heat dissipation, built-in strong wind cooling system. 3. Adopted new MCH ceramic double heating element is adopted, the platform has faster heating, more uniform temperature, and stable performance. 4. 5 professional mode selection, 3 common mode operation. Description: 1. Reflow Soldering Preheating Platform is designed for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow. 2. 5 application scene modes: degumming, layering, lamination, tin planting, and welding. 3. 3 commonly used memory temperatures, automatic recording of the current temperature and manual recording of the current temperature mode. 4. Suits for: Phone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max Key Description: "Add" button to adjust the temperature, long press to start heating; "Minus" key to adjust the temperature, long press to start cooling; "MEM" key to switch three temperature memory, long press to set the memory temperature; "SET" button to switch five modes, long press to set the mode temperature. Package includes: 1 x Host 1 x Power Cord 6 x Modules 12 x Steel mesh