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Mask Aligner-mda-400m

Mask Aligner-mda-400m

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Product Specifications

Product TypeMask Aligner
Dominant ColorGray
Light Source350nm-450nm UV
Intensity>15 mW/cm2
Mask Size5"x5"
Sample Size4" wafer
Dimensions1000x950x800 mm
UsagePhotolithographic processes for semiconductor and microelectronics manufacturing.
FeaturesUV Exposure, Precise Alignment, High Resolution, Easy Operation, Durable Design, Wide Usage

Product Overview

Key Features

Standard Features of Mask Aligner-MDA-400M :-
- Manual Control system
- Sample size : Piece~4" wafer
- Mask size : up to 5"x5"
- 350W UV Exposure Light source
- 350W Power Supply
- Dual CCD zoom microscope
- LCD ( 19 inch ) monitor
- Large Area Stationary Alignment Tooling Module with X,Y,Z and Theta motion
- Wedge Error Compensation ( Air bearing type )
- Dimension : 1000 (W) x 950 (D) x 800 (H) mm
System specification

A. Light source module
- Near UV light source : 350nm to 450nm
- 365nm Intensity : > 15~25 mW/cm2
- Max. Beam Size : 4.25" x 4.25"
- Beam Uniformity :
B. Microscope
- Dual CCD zoom microscope with 19" LCD monitor
- Magnification : 80x ~ 480x ( Monitor )

C. Stage and controller module
- Exposure Timer : 0.01 sec to 999.9 Hour
- Stage movement : X,Y,Z and Theta X, Y : 10 mm, Theta : A 5A , Z Motion Travel : 10 mm
- Contact Mode : Soft, Vacuum, Hard, S.

Company Details

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Seller Details

Taejeon, Taejeon

seles assistant manager

Ms. Camilla Lee

Address

589, YONGSAN-DONG, YUSEONG-GU, DAEJEON, Taejeon, Taejeon, 305-500, Korea South

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