Intelligent Mute Bga Chip Repair Machine Chinafix Cf360

We are offering our customers a wide range of Intelligent Mute BGA Chip Repair Machine CHINAFIX CF360, which are available following Specifications :-
Model:CHINAFIX CF 360
Solder Type: Leaded Solder / Lead Free
SMD Type:Micro bga,BGA,CSP,QFP
PCB Thickness:0.5mm~4mm
PCB Size:W50mm*D50mm~W455*D350mm
Heating Mode/Power (Upper):Hot-blast air /800W
Heating Mode/Power (Bottom):Hot-blast air /800W
Preheating Mode/Power:IR / 2400W
PCB Location Mode:Shape or Tongs
Drive Mode:Gear,Rack
Control / Adjusting Mode:Temperature control instrument
Temperature Range:Room Temperature 0~400A C
Max Power:4000W
Supply Volt:110V/220V
Machine Dimension:760mm(L)*700mm(W)*600mm(H)
Weight:36KG

CF360 characteristic:
1, The hot-air part adopts exported long-life heating coil, through special insulation heating treatment, heating uniformlier, long-life to use well.
2, The design of three warm areas support, can fine adjust to support height, avoid welding-area to sink.
3. The upper hot air-flow can be adjusted, use different air-flow to different chips, it's not easy to make expand.
4, Upper and bottom hot-air control temperature separately, it can store 10 items with 16 stages temperature curve setting-up. We can also provide 10 groups of common heating curve.
5, Over temperature protection function,over the temperature, heating coil automatic power off.
6, Intelligent mute function, keep mute under non-working condition.