Semi Automatic Bga Rework Station 6860 - 2*2 Mm To 55*55 Mm Size, White Color, 60 Kg Weight | Independent 3 Heating Zones, Precision Optical Alignment System, Multi-functional Touch Interface, Advanced Safety Protection

Desoldering the BGA Chip from the Motherboard:
Carefully detach the BGA chip from the motherboard using specialized desoldering techniques.

Cleaning the Pads:
Thoroughly clean the solder pads on the motherboard after removing the old BGA chip.

Reballing or Chip Replacement:
Either reball the existing chip or replace it with a new BGA chip, depending on the damage.

Alignment and Positioning:
Precisely align and position the BGA chip using techniques like silk frame or optical camera guidance.

Soldering the New BGA Chip:
Securely solder the new BGA chip onto the motherboard, ensuring proper connections.

Key Features of Our BGA Rework Station:

Independent 3 Heating Zones Temperature Control System:
Utilize upper and lower hot air heating zones along with bottom IR heating for controlled temperature profiles. Achieve temperature precision of A 1A C with 8-segment temperature control.

Precision Optical Alignment System:
Employ a high-definition CCD color optical alignment system for precise component placement, automatic color aberration resolution, and brightness adjustment. A 15" HD LCD monitor enhances visibility.

Multi-Functional and Humanized Operation System:
Experience a user-friendly HD touch interface. Our 2-in-1 upper heating head and mounting head design, along with adjustable titanium alloy BGA tuyeres, make installation and replacement seamless. Micrometer fine-tuning for X, Y, and R angles ensures accuracy up to A 0.01mm.

Superior Safety Protection:
Benefit from built-in safety features, including automatic alarm post-BGA welding, double over-temperature protection, and password-protected temperature parameters to prevent unauthorized changes.