High-speed Silicon Wafer Laserscribing Machine Ct-hp-800

The CT-HP-800 high-speed silicon wafer laser scribing machine issuitable for cutting monocrystalline/multicrystalline silicon waferson four sides, with rounded or chamfered corners. The equipmentintegrates various advanced automation technologies such as PLClaser, sensors, and servos, realizing the fully automatic processingof silicon wafer loading, detection, scribing, unloading, and boxpackaging
Unique mechanical structure design and technology make the edgesof the scribed silicon wafer smooth, the surface dust-free, andcomparable to the original wafer.

Capacity: 2800PCS/H (cutting 166166, 4 knives)Cutting accuracy: +0.05mm
Maximum operating speed of the equipment: 1000mm/s, adjustableApplicable silicon wafer size: 156156mm-210210mm/; (original wafer size)Applicable silicon wafer thickness range: 120-220umWorkbench size:165*165; optional 190*190X/YIZ travel: 650*650*50mm
Silicon drop size: 0.15mm/edge
Number of material boxes: 2: 250 pieces/boxEquipment failure rate: 3%Positioning method: mechanical positioningLoading and unloading method: automatic loading and unloadingElectrical system: PLC + touch screen + servo + moduleHuman-machine interface: touch screen display, friendly interface, and easy operationFault alarm: real-time fault alarm
Equipment color: main body traffic white + sky blueEquipment size: length * width * height 1600 *1300* 2000mmEquipment weight: 750KG