Fog/fob Bonding Machine Xch71-a3

Supported by the team of experts, we are the leading Manufacturer and Exporter of FOG/FOB Bonding Machine XCH71-A3 in Shenzhen, Guangdong, China.
Application:
The machine is used for bonding variety of FPC, COF, TAB to LCD PANELa TOUCH AENSOR and PCB.
Widely used in large-size LCD screen repair bonding, touch screen repair bonding and other fields.

Features:
1. The machine is adopted double guide rails and bearing guide in order to ensure up and down moving precision.
2. Group of micrometer adjustment with vacuum function enable bonding and absorbing synchronous working at the same time and save time.
3. Platform can move left and right along the guide rail, which is convenient for multi-position bonding on large-size glass.
4. Small size LCD light designing is adopted group of X-Y-Z adjustment that avoids adjusting repeatedly when it works.
5. Removable rack is more convenient to convey.
6. Independent design of vacuum attaching group solves the problem of traditional platform that failed to attach.

Basic Parameters:
Input power: AC220V 50-60HzA 10%50Hz 1.5KW
Rated power: 1.0KW
Working pressure: 0.4-0.8 Mpa
Method of heating: Constant/Pulse heating (optional)
Available size: within 65 inches (can be customized)
Visual system: Camera top/bottom alignment (optional), 7 inches display
Controlling program: Local PLC
Dimension: L2200*W1620*H1650mm