Bga Repair System (Zm-r5860c)

We are engaged in offering excellent quality BGA Repair System (ZM-R5860C) to our valuable clients.

Function: It could desolder, solder and rework all the BGA Chip of laptop, xbox360 and mobile motherboard. such as GPU, CPU etc.

Feature is High definition camera vision system, it could clearly see solder ball melting process.

Specification:-
* Total Power : 4800W
* Top heater : 800W
* Bottom heater : 2nd heater 1200Wi 3rd IR heater 2700W
* Power supply : AC220VA 10i 50/60Hz
* Machine dimension : L635*W600*H560mA
* Positioning : V-groove, PCB support can be adjusted in any direction with external universal fixture
* Temperature control : (K Sensor) closed loop, independent heating, precision within A 3A
* PCB size : Max 410A 370mm Min 20A 20 mm
* Electrical selection : Highly sensitive temperature control modulei Touch screen (Taiwan)+Delta PLC
* Weight : 40kg
* Package : Wooden Box
* G.W. : 78KG
* Package dimension : L78*W78*H77cm.