Bench Top Reflow Oven Sr300c
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Product Specifications
| Working size | 400x350 mm |
| Dimensions | 600x450x500 mm |
| Power supply | 220VAC |
| Power consumption | 3.5kW |
| Temperature range | 0-300°C |
| Temperature accuracy | ±1°C |
| Temperature uniformity | ±3°C |
| Features | High precision, Multi-function, Economical, Energy saving, Reliable, Long life, Visualization, PC communication |
Product Overview
Key Features
We are instrumental in providing to our valuable customers excellent quality Bench Top Reflow Oven SR300C which is available with following Features:
A. High precision, multi function; 0201 Resistance, capacitance, Diode, Transistor, fine pitch QFPa SOPa PLCCa BGAa CSP and other components can be solder with the machine; it is very popular for small batch and variety of production in small-middle factory, university and research.
B. Economical, useful and saving energy; it can be used to solidify SMD red glue;
C. Reliable performance, long using life;
D. Visualization operation;
Specification:
1. It can finish solder in stationary status, min pitch SMD components can be mounted;
2. Infrared and strong hot air cycle heat in solder area;
3. Dynamic tracking temperature, LCD shows changing temperature curve;
4. It is with PC communication connector, temperature curves can be saved in the machine by the software;
5. Working size 400A 350i mmi
6. Dimension 600A 450A 500i mmi
7. Power supplyi 220VAC
8. Power consumption: 3.5kw
9. Temperature range: 0a --300a lead free solder processi QFP/FPC/BGAi
10. Temperature accuracyi A 1a
11. Temperature uniformityi A 3a
A. High precision, multi function; 0201 Resistance, capacitance, Diode, Transistor, fine pitch QFPa SOPa PLCCa BGAa CSP and other components can be solder with the machine; it is very popular for small batch and variety of production in small-middle factory, university and research.
B. Economical, useful and saving energy; it can be used to solidify SMD red glue;
C. Reliable performance, long using life;
D. Visualization operation;
Specification:
1. It can finish solder in stationary status, min pitch SMD components can be mounted;
2. Infrared and strong hot air cycle heat in solder area;
3. Dynamic tracking temperature, LCD shows changing temperature curve;
4. It is with PC communication connector, temperature curves can be saved in the machine by the software;
5. Working size 400A 350i mmi
6. Dimension 600A 450A 500i mmi
7. Power supplyi 220VAC
8. Power consumption: 3.5kw
9. Temperature range: 0a --300a lead free solder processi QFP/FPC/BGAi
10. Temperature accuracyi A 1a
11. Temperature uniformityi A 3a
Company Details
Beijing Glichn S&T Development Co.,Ltd is professional manufacture and supplier for SMT and PCBA machines. Main machines includes solder paste printer, pick and place machine, reflow oven, wave soldering machine and others.
Business Type
Exporter, Manufacturer
Employee Count
55
Establishment
2008
Working Days
Monday To Sunday
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Intelligent Lead Free Reflow Oven - 8K Stainless Steel, Bench Top 250x350mm, Max Temperature 350°C | PID Control, Data Saving, Nitrogen Device Compatible
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Beijing, Beijing
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Seller Details
Beijing, Beijing
Ms. Karen Chang
Address
Room 1706, Building No.7, Liulitun, Chaoyang District, Beijing, Beijing, 100020, China
reflow oven in Beijing
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