MaterialSilicon
DiameterVarious
ThicknessVariable
ResistivitySpecified
OrientationCustomizable
Surface finishPolished
Diameter3-8 inches
Thickness<150µm
Resistivity0.005~1000 ohm-cm
TypeN/N+ P/P+ N/P+ P/N+
Epi LayerSingle/Multiple
MaterialSilicon
Pitch0.8mm
TypeSMT
MaterialPlasticMetal
Height2.8mm
ContactMultiple
PackagingTape & Reel
MaterialDiamond/Metal
Diameter100-300mm
Thickness10-50mm
Grit sizeVariable
Bond typeMetal
UsageSilicon wafer grinding
MaterialStainless steel
SizeDN50-DN300
PressurePN16-PN40
Temperature-20°C-180°C
ConnectionWafer type
End ConnectionFlanged
FeatureWafer Transfer
MaterialStainless steel
AutomaticYes
Product typeWafer Handling
ColorBlack
FeaturesPrecise transfer Wafer handling High throughput Automated operation Reduced downtime Improved yield Cost-effective Reliable performance
Price: 100.00 USD ($)/Set
MOQ1 Set/Sets
FeaturesGood Quality
Product TypeWafer Cleaning Machine
General UseIndustrial
MaterialStainless Steel
ComputerizedNo
AutomaticNo
Trusted Seller8 Years
Valve StandardAPI 609
Test StandardISO 5211
Working Pressure300PSI
Flanged EndsANSI B16.1
Class125/150/250
SizeDN65-DN300
Valve MaterialCast Iron
Size RangeDN40-DN900
End ConnectionsWafer Type
Seat MaterialNBR
Disc MaterialIron
Stem MaterialStainless Steel
Diameter8 inch
TypeP type
Thickness650μm
MaterialSilicon
GradeIC Grade
AvailabilitySpot & Long-term
MaterialRaw Materials
PurityHigh Purity
QualityChecked
DurabilityDurable
PriceCompetitive
ManufacturingQualitative
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| Company Name | Currency | Product Name | Price |
|---|---|---|---|
| - | - | Wafer Cleaning Machine | 100.00 USD ($) (Approx.) |
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