Semi Automatic Bga Hot Air Rework Station With Laser Positioning

We are major manufacturer, supplier and exporter of Semi Auto BGA Hot Air Rework Station With Laser Positioning in Shenzhen, Guangdong, China available with following details.

Specifications:

It is capable of repairing various type on component like BGA,QFP,IC,QFN, PLCC etc on motherboards, mobile phones,PSP,Xbox and many other electronics circuit boards.

Desolder ,remove, clean, reball, mount, solder BGA Chips, GA, QFP etc. SMT chips.Laptop,desktop computer,xbox360,psp,ps2 and mobile BGA Chip, such as CPU, GPU, south bridge, north bridge etc.Also apply to Lead free BGA Chip Rework.

Repair success rate is up to 99.9%.Also,good quality BGA reballing accessories like BGA reballing station.BGA solder ball,BGA stencils and laptop repair accessories are provided.

Parameters:

1 total power: 5500W
2 Upper heating power: 1200W
3 Lower heating power: Second temperature zone 1200W,Third temperature zone2700W
4 Power supply: (Single Phase)AC 220VA 10 50HzA 3 5.2KVA
5 Overall dimension: L880*W880*H720mm
6 Locating way: V-shaped groove,PCB holder can adjust any direction of X,Y Laser position
7 Temperature controlling: (high precision K-sensor)(Closed Loop),UP and down can test the temperature independently
8 Large PCB size: 580A 460mm
9 Small PCB size: 10A 10mm
10 Chip zoom multiple: 2-50 multiple
11 Weight of machine: 85kg