Rfid Label Flip Chip Bond Machine
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Product Specifications
| Model | Sll-Frw3200-Iii |
| Speed | 3200 Uph |
| Precision | +/-0.003Mm |
| Materials | Pet, Paper |
| Frequency | Hf, Uhf |
| Chip Size | 0.3-12Mm |
| Wafer Size | 6, 8, 12 Inch |
| Features | High Speed, Full Automatic, Cost Optimization, Easy To Use, Modular Design, High Precision, Versatile |
Product Overview
Key Features
Our offered RFID Label Flip Chip Bond Machine is the full automatic high speed RFID inlay (both HF and UHF) production system. It provides an innovation in flip chip assembly technology for RFID inlay and covers over 10 worldwide advanced patents.
The system has the modularity feature of optimum flexibility and beneficiates of advanced technology in high speed RFID inlay manufacturing.
The system realize an assembly and test speed up to 10,000 inlays per hour under Golden Spring's patented technology leadership in RFID production solutions. It is easy of use and brings cost optimization to your production site.
It is adapted to a large variety of markets, such as Olympic game tickets, World EXPO tickets, Logistics, good management, manufacturing, access control, library, retail, airport baggage tags, transportation applications and product tracking applications.
Technical Parameters:-
Model SLL-FRW3200-III
Speed 3200 UPH A 10%
Precision of robot +/-0.003mm
Support materials PET, Paper
Support frequency HF, UHF
Chip size 0.3-12mm
Compatibe type roll and sheet
Wafer Size 6 inch,8 inch,12 inch is can be customized.
The system has the modularity feature of optimum flexibility and beneficiates of advanced technology in high speed RFID inlay manufacturing.
The system realize an assembly and test speed up to 10,000 inlays per hour under Golden Spring's patented technology leadership in RFID production solutions. It is easy of use and brings cost optimization to your production site.
It is adapted to a large variety of markets, such as Olympic game tickets, World EXPO tickets, Logistics, good management, manufacturing, access control, library, retail, airport baggage tags, transportation applications and product tracking applications.
Technical Parameters:-
Model SLL-FRW3200-III
Speed 3200 UPH A 10%
Precision of robot +/-0.003mm
Support materials PET, Paper
Support frequency HF, UHF
Chip size 0.3-12mm
Compatibe type roll and sheet
Wafer Size 6 inch,8 inch,12 inch is can be customized.
Company Details
Golden Spring Internet of Things Inc., Established in 2004 at Beijing in Beijing, is a leading Exporter,Manufacturer,Supplier of Label & Sticker Labeling Machine in China. Golden Spring Internet of Things Inc. is one of Trade India's verified and trusted sellers of listed products. With extensive experience in supplying and trading RFID Label Flip Chip Bond Machine, Golden Spring Internet of Things Inc. has made a reputed name for itself in the market with high-quality RFID Label Flip Chip Bond Machine, etc.
Focusing on a customer-centric approach, Golden Spring Internet of Things Inc. has a pan-India presence and caters to a huge consumer base throughout the country. Buy Label & Sticker Labeling Machine in bulk from Golden Spring Internet of Things Inc. at Trade India quality-assured products.
Focusing on a customer-centric approach, Golden Spring Internet of Things Inc. has a pan-India presence and caters to a huge consumer base throughout the country. Buy Label & Sticker Labeling Machine in bulk from Golden Spring Internet of Things Inc. at Trade India quality-assured products.
Business Type
Exporter, Manufacturer, Supplier
Establishment
2004
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Seller Details
Beijing, Beijing
Account Manager
Mr. Lotus Qi
Address
Room 1101-02, Building 7, No.99, Kechuang Fourteenth Street, Economic Technological Development Area, Beijing, Beijing, 100176, China
rfid chip in Beijing
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