Rfid Label Flip Chip Bond Machine
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Product Specifications
| Chip Size | 0.3-12Mm |
| Features | High Speed, Full Automatic, Cost Optimization, Easy To Use, Modular Design, High Precision, Versatile |
| Frequency | Hf, Uhf |
| Materials | Pet, Paper |
| Model | Sll-Frw3200-Iii |
| Precision | +/-0.003Mm |
| Speed | 3200 Uph |
| Wafer Size | 6, 8, 12 Inch |
Product Overview
Key Features
Our offered RFID Label Flip Chip Bond Machine is the full automatic high speed RFID inlay (both HF and UHF) production system. It provides an innovation in flip chip assembly technology for RFID inlay and covers over 10 worldwide advanced patents.
The system has the modularity feature of optimum flexibility and beneficiates of advanced technology in high speed RFID inlay manufacturing.
The system realize an assembly and test speed up to 10,000 inlays per hour under Golden Spring's patented technology leadership in RFID production solutions. It is easy of use and brings cost optimization to your production site.
It is adapted to a large variety of markets, such as Olympic game tickets, World EXPO tickets, Logistics, good management, manufacturing, access control, library, retail, airport baggage tags, transportation applications and product tracking applications.
Technical Parameters:-
Model SLL-FRW3200-III
Speed 3200 UPH A 10%
Precision of robot +/-0.003mm
Support materials PET, Paper
Support frequency HF, UHF
Chip size 0.3-12mm
Compatibe type roll and sheet
Wafer Size 6 inch,8 inch,12 inch is can be customized.
The system has the modularity feature of optimum flexibility and beneficiates of advanced technology in high speed RFID inlay manufacturing.
The system realize an assembly and test speed up to 10,000 inlays per hour under Golden Spring's patented technology leadership in RFID production solutions. It is easy of use and brings cost optimization to your production site.
It is adapted to a large variety of markets, such as Olympic game tickets, World EXPO tickets, Logistics, good management, manufacturing, access control, library, retail, airport baggage tags, transportation applications and product tracking applications.
Technical Parameters:-
Model SLL-FRW3200-III
Speed 3200 UPH A 10%
Precision of robot +/-0.003mm
Support materials PET, Paper
Support frequency HF, UHF
Chip size 0.3-12mm
Compatibe type roll and sheet
Wafer Size 6 inch,8 inch,12 inch is can be customized.
Company Details
Established in 2004, Golden Spring Internet of Things Inc. has made a name for itself in the list of top suppliers of Label & Sticker Labeling Machine in India. The supplier company is located in Beijing, Beijing, and is one of the leading sellers of listed products.
Golden Spring Internet of Things Inc. is listed in Trade India's list of verified sellers offering supreme quality of RFID Label Flip Chip Bond Machine, etc. Buy Label & Sticker Labeling Machine in bulk from us for the best quality products and service.
Golden Spring Internet of Things Inc. is listed in Trade India's list of verified sellers offering supreme quality of RFID Label Flip Chip Bond Machine, etc. Buy Label & Sticker Labeling Machine in bulk from us for the best quality products and service.
Business Type
Exporter, Manufacturer, Supplier
Establishment
2004
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Seller Details
Beijing, Beijing
ACCOUNT MANAGER
Mr. Lotus Qi
Address
Room 1101-02, Building 7, No.99, Kechuang Fourteenth Street, Economic Technological Development Area, Beijing, Beijing, 100176, China
rfid chip in Beijing
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