
Hdi Pcb Via-in-pad Filled Vias Thin Laminate And Prepreg
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Product Specifications
| Board Thickness | 1.5mm |
| Surface Treatment | ENIG |
| Line/Space | 4.0/4.0mil |
| Smallest Hole | 0.15mm |
| Layers | 8L |
| Material | FR4 |
| Via Type | Micro Vias |
| Features | High Density, Thin Laminate, Filled Vias, Precise Design, Reliable Quality, Cost Effective, Fast Delivery |
| FOB Port | shenzhen |
| Payment Terms | Others, Cash Advance (CA) |
| Main Export Market(s) | Middle East, Central America, Australia, South America, Western Europe, Asia, Eastern Europe, North America, Africa |
Product Overview
Key Features
Application Field: Communication
Layer/Board Thickness: 8L/1.5mm
Surface Treatment: ENIG
Line/Space: 4.0/4.0mil
Smallest Hole Diameter: 0.15mm
Technical Feature: 1+1+4+1+1i Micro vias, plugged resin and plated over.
Company Details
Focusing on a customer-centric approach, HX Circuit Technology Co.,Ltd. has a pan-India presence and caters to a huge consumer base throughout the country. Buy Circuit Boards in bulk from HX Circuit Technology Co.,Ltd. at Trade India quality-assured products.
Business Type
Exporter, Manufacturer
Employee Count
320
Establishment
2010
Working Days
Monday To Sunday
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Seller Details
Shenzhen, Guangdong
Mr Annie Zhang
Address
7 floor, Huachuangda YiJing Building, Baoan 45 District, Shenzhen, Guangdong, China
aluminium pcb in Shenzhen
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