Electronic Cooling Design And Thermal Analysis
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Product Specifications
| Analysis Type | CFD |
| Cooling Methods | Passive, Active |
| Software | Industry standard |
| Design Levels | System, Board |
| Optimization Techniques | DOE, Six Sigma |
| Usage | Electronic component thermal management, heat sink design, and system-level cooling solutions. |
| Deliverables | Reports, simulations |
| Features | Thermal analysis, Design services, Passive cooling, Active cooling, System optimization |
Product Overview
Key Features
We are offering Electronic Cooling Design and Thermal Analysis Services to our clients which are situated all round the nation. Our core competencies ensure that our customers can count on highly engineered solutions that refine the capabilities of both passive (advanced cooling methods, liquid cooling/heat pipe/two-phase heat transfer) and active cooling technologies (natural/forced convection air cooling). Using a variety of heat transfer technologies, including advanced cooling methods passive two-phase devices (heat pipes, heat exchangers and more) and single phase devices (liquid cold plates and pumped liquid systems, optimized heat sinks), we apply these technologies to thermal solutions in different industries and horizontal markets.
System level design involves
Selection of fans based on system impedance study
Design of the Heat Sinks or Heat Exchangers for the maximum power
Optimization of the Heat Sink parameters like fins
Analysis of the entire heat transfer phenomenon's in the device
Optimization for min heat generation inside the device
Board level design involves
Design of the circuit that involves placement of components over the board
Design of the solution for cooling the most vulnerable components like placement of heat spreader, design for heat pipe, etc
System level design involves
Selection of fans based on system impedance study
Design of the Heat Sinks or Heat Exchangers for the maximum power
Optimization of the Heat Sink parameters like fins
Analysis of the entire heat transfer phenomenon's in the device
Optimization for min heat generation inside the device
Board level design involves
Design of the circuit that involves placement of components over the board
Design of the solution for cooling the most vulnerable components like placement of heat spreader, design for heat pipe, etc
Company Details
EDATTECH, Established in 2009 at Hyderabad in Telangana, is a leading service provider of Electronic Engineering Services in India. EDATTECH is one of Trade India's verified and trusted names for listed services. With extensive experience in the field of Electronic Engineering Services, EDATTECH has made a reputed name for itself in the market with satisfactory Electronic Cooling Design And Thermal Analysis, etc.
Focusing on a customer-centric approach, EDATTECH has a pan-India presence and caters to a huge consumer base throughout the country. Get Electronic Engineering Services from EDATTECH at Trade India quality-assured services.
Focusing on a customer-centric approach, EDATTECH has a pan-India presence and caters to a huge consumer base throughout the country. Get Electronic Engineering Services from EDATTECH at Trade India quality-assured services.
Business Type
Service Provider
Establishment
2009
