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Blind And Buried Board (4-layer)
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Blind And Buried Board (4-layer)

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Product Specifications

MaterialFR-4
Thickness1.6MM
Surface PlatingImmersion Ag
Layers4
Via TypeBlind/Buried
Min Hole Size0.2mm
DimensionsVariable
FeaturesHigh Density, Blind Vias, Buried Vias, Cost Effective, Reliable, Durable, High Quality, FR-4 Material

Product Overview

Key Features

We are instrumental in providing to our valuable customers excellent quality Blind And Buried Board (4-Layer) which is available with following specification:-
Material: FR-4, 1.6MM
Surface Plating: Immersion Ag
Remark: blind/ bruied via.min.
Hole size; 0.2mm

Clients can avail this Blind And Buried Board (4-Layer) at industry leading prices from us.

Company Details

XG Technologies Co.,Ltd., Established in 2006 at Shenzhen in Guangdong, is a leading Exporter,Distributor,Supplier,Trading Company of Circuit Boards in China. XG Technologies Co.,Ltd. is one of Trade India's verified and trusted sellers of listed products. With extensive experience in supplying and trading Blind And Buried Board (4-Layer), XG Technologies Co.,Ltd. has made a reputed name for itself in the market with high-quality 4 Layer Combined Layers FPC, 4 Layers FPC, AL-Based Board, etc.
Focusing on a customer-centric approach, XG Technologies Co.,Ltd. has a pan-India presence and caters to a huge consumer base throughout the country. Buy Circuit Boards in bulk from XG Technologies Co.,Ltd. at Trade India quality-assured products.

Business Type

Exporter, Distributor, Supplier, Trading Company

Establishment

2006

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Seller Details

Shenzhen, Guangdong

Sales Director

Mr. James Yao

Address

503A Yongdongxin Building Xinsha Rd Shajing Town Baoan District, Shenzhen, Guangdong, 518104, China

multilayer pcb in Shenzhen

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