Ball Grid Array (Bga) Co-design Layout Services
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Product Specifications
| Ball Pitch | Variable |
| Compliance | IPC |
| Design Methodology | Co-design |
| Die Size | Range |
| Features | Optimized layouts, Seamless system, Improved performance, Cost effective, Faster turnaround |
| Package Type | BGA |
| Substrate Material | Various |
| Usage | PCB assembly and integration |
| Payment Terms | Letter of Credit (L/C), Telegraphic Transfer (T/T), Others |
Product Overview
Key Features
To fit the needs of our patrons, we are associated with Supplying an outstanding Ball grid Array (BGA) Co-Design Layout Services from Hyderabad, Telangana, India. We painting carefully with proto and excessive-volume substrate and assembly houses to offer a seamless co-layout system. All our substrates are designed the use of our co-layout technique in which the BGA format/ballout is optimized for green bondpad placement on the die and optimized routing on the board to meet all overall performance specifications.
Company Details
Established in 2013, Tessolve Semiconductors has made a name for itself in the list of top service providers of Engineering & Consulting Services in India. Tessolve Semiconductors is listed in Trade India's list of verified companies offering a wide array of Ball grid Array (BGA) Co-Design Layout Services, Test And Product Engineering Service, etc. Contact here for Engineering & Consulting Services in Bengaluru, Karnataka.
Business Type
Manufacturer, Service Provider, Supplier
Establishment
2013
Working Days
To
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Seller Details
Bengaluru, Karnataka
Engineer
Mr. Subin
Address
4-7-12, Electronics City Phase 1, Doddathoguru, Bengaluru, Karnataka, 560100, India
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