Atmospheric Plasma System Plasmabeam Mini

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the atmospheric pressure plasma system PlasmaBeam Mini, you can rely on the modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 3 - 5 mm, substrates can be treated locally with precision.

In contrast to the Plasmabeam devices, the PlasmaBeam Mini is designed for laboratory use. The PlasmaBeam technology enables local surface cleaning without masking the rest of the surface. For example, cleaning Al, Au and Cu bond pads before wire bonding without touching the rest of the surface. The active gas jet coming out of the plasma nozzle is always free of dangerous voltage potential. This allows the unit to be used for various processes in the electronics industry such as:

Bond pad cleaning prior to wire bonding.
Activation of glass and aluminium in smartphone manufacturing
Activation of chip surfaces before printing or encapsulation
Activation of housings in which electronics are installed
Treatment of electrical, voltage-sensitive assemblies before encapsulation

Furthermore, the PlasmaBeam is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastic, rubber, metal, glass, ceramic, hybrid materials.

Main features:
Table-top housing
Plasma generator Treatment width 3 - 5 mm
Generator Frequency approx. 20 kHz Power approx. 80 W
Process and cooling gas: Dry, oil-free compressed air; inlet pressure 5 - 8 bar; gas consumption approx. 5 - 6 l/min
Power supply 230 V, 50 Hz
Control: Manual - via button on the front panel of the unit; Semi-automatic - remote control via remote (connection on the rear panel of the unit)