830 Tie Points Prototype Solderless Breadboard With Black Aluminium

Following are the Main Features of 830 Tie Points Prototype Solderless Breadboard With Black Aluminium :
a 830 tie points solderless breadboard;
a With breadboard size of 165L x 56W x 8.5H(mm);
a Baseplate breadboard size of 183 x105 x 1.5(mm);
a Standard 0.1a (2.54mm) hole spacing;
a Suitable for 19-28 AWG wire;

Description:
a An black aluminum backing secures the 830-point breadboard to your project;
a A magic combination breadboard pattern of isolated tie points
a Highest quality solderless breadboard, commonly used for prototyping.
a An invaluable tool for the most demanding prototyping and design applications in the R&D or University lab.
a Consists of a set of formed metal sockets inserted into a durable plastic housing.
a Allows you to quickly build temporary circuits without soldering.
a Breadboards accept most through-hole parts and up to #22 wire.
a When youa re done or want to change your circuit, ita s easy to take your circuit apart.
a When breadboarding, pre-cut jumper wire kits and premium jumper wires is very convenient.
a Wires and components can be used and re-used many times without damage to board or components.