1a1 Parallel Grinding Wheel

With a sole aim in delivering quality products, we are the prominent Exporter, Manufacturer & Supplier of 1A1 Parallel Grinding Wheel in Zhengzhou, Henan, China.
Resin binder having a good self-sharpening, sharp cutting, high grinding efficiency, workpiece surface roughness is low, less heat, easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.
The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.
Material of workpiece: synthetic sapphire, Monocrystalline silicon, gallium arsenide and gallium nitride and other materials
Juchuang Abrasive offers a variety of resin bonded grinding wheel,
Diameter range: I 6-900mm, wheel thickness: 0.5-400mm, grit size: 30/35-w0.5, offer the special wheels as customera s requirements.