
1a1 Parallel Grinding Wheel
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Product Specifications
| Diameter | 6-900Mm |
| Thickness | 0.5-400Mm |
| Grit Size | 30/35-W0.5 |
| Material | Resin Bond |
| Application | Wafer Grinding |
| Color | Grey |
| Shape | Circular |
| Features | High Efficiency, Sharp Cutting, Low Roughness, Precision Grinding, Less Heat, Self-Sharpening, Versatile Material |
Product Overview
Key Features
Resin binder having a good self-sharpening, sharp cutting, high grinding efficiency, workpiece surface roughness is low, less heat, easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.
The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.
Material of workpiece: synthetic sapphire, Monocrystalline silicon, gallium arsenide and gallium nitride and other materials
Juchuang Abrasive offers a variety of resin bonded grinding wheel,
Diameter range: I 6-900mm, wheel thickness: 0.5-400mm, grit size: 30/35-w0.5, offer the special wheels as customera s requirements.
Company Details
Focusing on a customer-centric approach, Zhengzhou Juchuang Abrasive Co,.Ltd has a pan-India presence and caters to a huge consumer base throughout the country. Get Diamond Grinding Wheel from Zhengzhou Juchuang Abrasive Co,.Ltd at Trade India quality-assured services.
Business Type
Exporter, Manufacturer, Service Provider, Supplier
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Seller Details
Zhengzhou, Henan
Name
Mrs. Wandaliu
Address
null Zhengzhou, Henan, 450000, China
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