Thermal Management For Circuit Boards - Optimized Heat Management Solutions | Low Thermal Resistance, Customized Forms, Various Thickness Options, Photosensitive Solder Stop

Being popular name in the industry we make and supply a wide array of Thermal Management For Circuit Boards from Bengaluru, Karnataka, India. Which uses constructive procedures to dissipate heat directly on the circuit board level. This is an economic way of protecting high-performance components against excess temperatures and it ensures flawless functioning and high durability. Heatsink technology highlights - an overview:

Heatsink applications offer optimized heat management
Thin circuit board for good heat conduction and high cycle stability
Combination of vertical and horizontal cooling
Vertical cooling through thermovias or microvia/buried via combination
Horizontal cooling through heat spreading in copper layers and/or heatsink
Low thermal resistance
Various thicknesses possible
Customized forms possible
Photosensitive solder stop, various final surfaces possible
Suitable for wire bonds