Rfid Tag Flip-chip Bonding Machine

With the support of our expert our company is dedicated Exporter Manufacturer & Supplier of RFID Tag Flip-Chip Bonding Machine in Ezhou Hubei China.
Specifications:
Adopts flip-chip bonding technology: Pick the die chip from thewafer and bond it directly with the antenna then heat and press the ACA/NCA glue will solidify and the inlay package is achieved the equipment integrates dispensing flip patch final bondingonline testing rewind and unwind of substrate transporting module and applies to all kinds of HF/UHF RFID tag inlay efficient packaging

Features:-
Based on high-precision positioning technology such as thevisual image processing guiding high speed trajectory-timingplanning and closed-loop control of grating precision feedbackachieve to place microchip (minimum 0.3 x 0.3mm2 chip) fastprecisely and cost effective
Via tension-positioning mixed control or distributed controlachieve to feed and place precisely in multiple amplitude andlong-span flexible membrane matching the point-by-point positioningtechnology could adapt domestically antenna substrate and make theantenna cost lower more than 50% than imported substrate
Use time pressure of non-Newtonian fluid dispensing processcontrol technology to achieve the precise control of the amount ofglue and save 30% of the cost compared with traditional dispensing process
Use the intermittent movement the tact control technology ofthe optimized components to improve the stability of the systemwhile reducing th