Lga 1366 Server Cpu Socket - 43x41 Grid Array, Superior Solder-joint Reliability & Thermal Mismatch Prevention

With excellent solder-joint and contact reliability, the Molex LGA 1366 Server CPU Socket supercedes its predecessor, the LGA 771 Socket, and eliminates the possibility of thermal mismatch during board processing

The LGA 1366 (Land Grid Array) is a Server CPU socket designed for Intel's* Nehalem micro-architecture that uses an LGA 1366-pin packaging and smaller pitch size of 1.016mm (.040") by 1.016mm (.040"). The LGA 1366 socket is commonly referred to as Socket B, socket 1366 or LGA 1366, this socket mates with the server processor through the gold pads of the LGA 1366 package.

The LGA 1366 socket is a replacement of the Socket 771 for the server market. The socket contacts are arranged in a 43-by-41 grid array with a 21-by-17 grid depopulated at the center of the array. This high-density LGA socket has a low-profile and utilizes the proven Ball Grid Array (BGA) soldering technology for stable PCB processing. It features excellent solder-joint reliability and does not have the same thermal mismatch issues as do its predecessors, the LGA 771 (Socket J) and the LGA 775 sockets (Socket T). The latter sockets, being single-piece parts, comprise metal plates heat-staked to socket housings. When made to go through the reflow oven at the same time, these parts absorb heat differently, causing the metal component to heat up more quickly than the socket housing. This results in lower solder-ball temperature, uneven heat distribution throughout socket, dynamic warpage and poor sold