Lead Free Solder Paste By Shenzhen Earlysun Technology Corp., Ltd

We are highly reputed exporter of a trusted quality gamut of Lead Free Solder Paste in Shenzhen, Guangdong, China available with following details.

Introduction:
ES-380 is a low-silver lead-free solder paste, an air re-flow, no-clean solder paste. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. high activity, cost-effective adoption of lead-free spherical powders and additives. Applied to generic lead-free environmentally friendly electronic Assembly.
Key Performance Needs
i High oxidation barrier to eliminate grapping and HIP defects
i high probe testability of minimizes false failures in ICT
i Highly probe testable flux residue, EN14582 test method
i Excellent print transfer efficiency on 0.4mm pitch CSPs
i Oxidation resistance is strong,
i Bright surface of solder, High activity
i very few residues and features such as transparent
i comparable with SAC305 solder paste
Alloys
Low-oxide spherical powder composed of a variety of Pb-Free alloys that cover a broad range of melting temperatures. Type 4 and Type 3 powder are standard offerings with SAC305 & SAC387 alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application.