High Lead Base Solder Paste Equipment Materials: Printed On Synthetic Paper

We are highly proficient exporter of premium quality High Lead Base Solder Paste in Shenzhen, Guangdong, China available with following details.

Introduction:

ES-660 is a High-Lead solder paste, using for precision power semiconductor packages, meet the printing process. It can be used in the package of power tubes, diodes, transistors, rectifier bridges, small integrated circuit and other products.
Key Performance Needs
i It is good stability, automatic dispensing smooth.
i Chemical stability, slow solvent evaporation, can be printed for a long time without affecting the viscosity of the solder paste.
i Good weldability, residue is easy to clean after welding, and the joints are very small porosity.

Alloys
This product is specifically for the use of power semiconductor packaging and welding. And have wide operation window, can meet printing and dispensing process. Good weldability, also very
small porosity. Good moisture, in the air it can be dispensed for more than 24 hours, and the viscosity change is small, does not affect the consistency of dispensing. The residue has large insulation resistance, can be used for no-clean process, and the residue can soluble in organic solvents also. Solder joints after welding are full, bright, high strength and excellent electrical properties. 2-10a environment can be kept under seal for 6 months, and can be stored at room temperature for one week.