Halogen Free Lead Free Solder Paste

We are the largest manufacturer of Halogen Free Lead Free Solder Paste in Shenzhen, Guangdong, China. ES-1000 is a dispensing Halogen Free solder paste designed and formulated specifically for die attach processes. The flux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wire bond pads and for improved environmental compliance. Normally used with high temperature alloys, ES-1000 is designed for reflow in a forming gas or nitrogen atmosphere at less than 100ppm O2. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.

Alloys
Earlysun Corporation manufactures low oxide spherical powder in a standard Type 6 & 7 mesh size. Other mesh sizes are available upon request. The weight ratio of the solder powder to the solder paste is referred to as the metal load and is typically 85% for standard alloy compositions.

Key Performance Needs
i Ultra-Low Voiding with Minimal Profiling
i Halogen-Free, No separation, No tailing
i No Corrosion of Wire Bond Pads
i Bubble Free (airless)
i Reliable Clog-Free Dispensing
i Consistent Dispensing Deposit Size
i Residue-free cleaning

Dispensing
ES-1000 is formulated to be applied using automated high speed, high reliability, single point or multi-point dispensing equipment, but will also function in hand held applications. Highly accurate volumes can be dispensed using either pneumatic or positive displacement devices.