Contactless Ic Module Picking-placing Machine

We are manufacturing, exporting, importing and supplying huge range of Contactless IC Module Picking-Placing Machines in Tianjin, China.

Contactless IC Module Picking-Placing Machine is designed for precisely placing the single contactless IC chip onto chip fixing holes in the INLAY sheet. In order to ensure chip fixing precision, the IC chips are picked and placed with vacuum after air cylinder holds the PVC sheet to ensure its flatness.
Photoelectric sensor is applied to monitor and control the chip feeding. If failure or mistake occurs, it will give warning and stop the machine.
High-precise dual-axles are used to pick, move and place the chips with PLC controlled in order to ensure high position precision.
Picking or placing location for each module can be individually adjusted to ensure high precision of positioning.
It is designed to have two picking-placing units and two working tables to ensure high efficiency.
The liquid glue injection unit is available in the latest design.
It is controlled by Mitsubishi PLC with big-size colorful man-machine interface display. All the pneumatic parts are made by SMC.
Different sheet layout (such as 3A 8/4A 8/5A 5) can be proceeded on the same machine.


Technical Parameters:
Speed: 4000-4500 pcs per hour.
Dimension: L1600A W700A H1900mm
Weight: 650 KG
Power supply: AC220V 50/60HZ
Power: 3KW
Compressed air: 6 kg/cm2
Air Consumption: 30 L/min.