Laser Grooving Machine - Cutting Area 1200x400mm, 20-60aum Depth, 2000mm/s Speed | High Speed, Software Controlled, Automated Process, Precise Grooving, Easy Maintenance

Our organization is engaged in providing a superior range of Laser Grooving Machine, which is ideal for in scribing ceramic, silicon wafers and solar cells. It is made using best grade raw materials, which are sourced from certified vendors in the market. Furthermore, our range is highly appreciated by our clients for their smooth operation, easy maintenance and easy installation. Features:- High processing speed Easy operation and maintenance free Controlled by software automatically Excellent performance with its low cost Specifications:- Parameter : Description Grooving width : 10-30I m, A 2I m Grooving depth : 20-60I m, A 2I m Grooving speed : 2000mm/s Worktable flatness : A 10I m Worktable repeating accuracy : A 10I m Cutting area : 1200A 400mm, as per customers' requirements Power supply : Three-phase, AC 380V, 50 Hz / 60 Hz Input power : 8 kW Dimensions : 2600A 1800 A 1400mm Net weight : 3500 Kg Cooling system : Water cooling Laser medium : CO2 wavelength : 1064 nm Beam power : 10 W Power supply : AC 220V A 10%, 50Hz/60Hz Input power : 2.1 kW Marking speed : Adjustable, max 5000 mm/s Marking area : F=160 mm 70 x70 mm F=220 mm 100 x100 mm F=250 mm 150 x150 mm Dimension : 5500 x 290 x 650 mm Net weight : 33.75 Kg Cooling system : Air cooling Clients can avail this Laser Grooving Machine at industry leading prices from us.