Ceramic Wafer Scribing Machine

Our organization is engaged in providing a wide range of Ceramic Wafer Scribing Machine to our clients. Our range of machines is designed in accordance with industry standards and under the guidance of our experts. These Ceramic Wafer Scribing Machines find huge demand in the market for their unique features such as high quality, smooth functionality and long service life.

Features:-
Excellent beam quality and system reliability
High-speed scribing (up to 300 mm/s), very low-defective index
Auto cooling system
Precise CNC worktable
Friendly man-machine interface and simple software operation

Specifications:-
Parameter : Description
Laser medium : Nd3+: YAG
Wavelength : 1064 nm
Pump source : Krypton lamp
Laser cavity : Ceramic
Modulated frequency : 0.5-50 kHz
Beam power : 50 w
Aiming beam : Red beam
Cutting speed : 0-120 mm/s
Cutting depth :Max 1.2 mm
Line width : Min 0.2 mm
Cutting area : 300 A 300mm
Power supply :AC 380V A 10%, 50Hz/60Hz

Clients can avail this Ceramic Wafer Scribing Machine at industry leading prices from us.