Cutting Dicing Saws

Cutting Dicing Saws are precision diamond wire saw is designed to provide smooth cutting or slicing for all kinds of materials, especially for larger size crystals, such as Si, Ge and GaAs, etc., up to 12" (300 mm) diameter. It cuts the crystal by a diamond impregnated wire (0.28 mm diameter) which moves repeatedly backwards and forwards with the help of a digital controller. STX-1202 is equipped with angle adjustable sample holder. Please visit our or contact Global Nanotech Equipment by for more information in detail.

Global Nanotech Equipment also provides EQ-MT-5, EQ-MT-4, EQ-MT-200, EQ-QG-50, EQ-SYJ-150, EQ-SYJ-160, EQ-SYJ-200, EQ-EC-400 ( Diamond Blade Saws ) and EQ-SXJ-2 , EQ-STX-402, EQ-STX-603, EQ-STX-1202 (and Diamond Wire Saws ) for high quality lab equipment in the world.
A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin Diamond Blade Saws or Diamond Wire Saws to dice, cut, or groove semiconductor wafers ,silicon, glass, ceramic, crystal and many other types of material..
A diamond blade is a saw blade which has diamonds fixed on the blade's base to use the diamonds to cut hard or abrasive materials. There are a lot of types of diamond blades, and they have been applied in many industries, for example, construction industry to cut stone, concrete, asphalt, bricks, glass and ceramics, IT industry to cut semiconductor.