Polishing Machine - Super Flat 14-15" Lapping Plate, High Precision For Polishing Crystal Components And Semiconductor Wafers

Polishing Machine with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three work stations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples. We provide you with cost effective polishing machine to meet your budget and application. Please visit our or contact Global Nanotech Equipment by for more information in detail.

Polishing is the process of creating a smooth and shiny surface by rubbing it or using a chemical action, leaving a surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations) In some materials (such as metals, glasses, black or transparent stones) polishing is also able to reduce diffuse reflection to minimal values. When an unpolished surface is magnified thousands of times, it usually looks like mountains and valleys. By repeated abrasion, those "mountains" are worn down until they are flat or just small "hills." The process of polishing with abrasives starts with coarse ones and graduates to fine ones.
Global Nanotech Equipment also provides the following Polishing Machines for high quality lab equipment in the world.