Copper Bonding Wire

Our offered range of Copper Bonding Wire is available with following specifications :-
1. Copper bonding wire in semiconductor devices as a connection material between chip and the outside of the main circuit, with excellent mechanics Properties, electrical properties (101% IACS) and the second bonding-spot stability.
2. Copper bonding wire is treated by the special process, with the fine features which can replace the gold wire easily.
3. Strict Preparation grantee single-crystal copper bonding wire with smooth, clean surface, and stability performance into welding ball.
4.Columnar crystal organization guaranteed the single-crystal copper bonding wire to had been Oxidized hardly.
5. Skilled volume line guaranteed the copper bonding wire unlashing smoothly, to avoid the line break during application.
6. Ultra-fine single-crystal copper bonding wire (a 0.015 mm) has good mechanical properties, electrical properties and stability, to meet in the application for IC and other semiconductor package.