
Alloy Bonding Wire
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Product Specifications
| Bonding | First joint improved |
| Diameter | 0.6mil-1.2mil |
| Features | High strength, Cost effective, Stable process, Wide adaptability, Replace gold wire, Reworkable, High density, Consistent UPH |
| Gas | No H2 and N2 |
| Joint | Stable 2nd joint |
| Material | Silver alloy |
| Packaging | IC, LED, power devices |
| Smelting | Precise process |
Product Overview
Key Features
Features:-
a It is used in LED, high-density packaging and other areas , can replace gold bonding wire after adjusting few of the related parameters .
a Less than 70-80% of the cost of gold wire with the same diameter
a Precise alloy smelting process can ensure excellent stability of the alloy wire. And No H2 and N2 forming gas in bonding process.
a The consistency and wide adaptability of 2nd joint and process of balling is stable.
a Its high strength can help improve the mechanical properties of the 1st bonding joint.
a Available to do Rework and Stack-chip.
a UPH be consistent with gold wire.
Diameter range: from 0.6mil--1.2mil
Clients can avail from us this range of Alloy Bonding Wire at most affordable prices.
Company Details
Everyoung I/E Corp., Ltd. is listed in Trade India's list of verified sellers offering supreme quality of Alloy Bonding Wire, Copper Bonding Wire, Insulated OCC Copper Wire, etc. Buy Wires/Cables & Accessories in bulk from us for the best quality products and service.
Business Type
Exporter, Manufacturer
Establishment
2008
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Seller Details
Zhengzhou, Henan
Name
Ms. Zhao
Address
12-F, Fazhan Building, 159, Jiankang Road, Zhengzhou, Henan, 450012, China
bonding wire in Zhengzhou
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