Bga Repair Machine

Technical Specifications of BGA Repair Machine :
1i Total poweri 4.2KW
2i Up heating poweri 800W
3i Heating power of 3rd temperature areai 800W
4i Thermostat heating poweri 2400W
5i Power supply i Single phase 220V/230V 50/60Hz 4.5KVA
6i Machine dimensioni 450A 550A 650mm
7i Temperature controli high-precision K sensor
8i Positioningi V-groove for PCB positioning, Max PCB size 280A 395mm
9i Weighti About 30kg

Features:
1. Choose imported high-precision materials (temperature sensor, heater) to control the BGA desoldering & soldering procedures precisely.
2. There are three independent heating areas from top to bottom. the first and second temperature areas can control many groups & sections of temperature parameters at the same time. The third area preheats the PCB thoroughly to achieve the best welding effect.
3. Choose imported high-precision thermocouple to detect top/down temperature precisely. With a function of over-temperature protection.
4. Top & bottom temperature areas heat independently, A cross-flow fan cools rapidly to protect the PCB from deformation when welding.
5. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.
6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.
7. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.