Semi Automatic Cog Pre Bonding Machine

We are leading voice for exporting and producing of Semi Automatic COG Pre Bonding Machine with the following details:
1, Machine function description :
The equipment is a semi-automatic COG pre-bonding machine i Chip on glassi ,it can satisfy high bonding accuracy in whole process of IC pre-alignment on the product of ITO STN-LCDa COLOR STN-LCDa TFT-LCDa OLED-LCD .
2. Working Method:
1> LCD placed on alignment table manually and press vacuum & start button.
2> Alignment table enter into alignment status automatically to align and bond pre-absorbed & adjusted IC with LCD
3> Table exits and vacuum turned off automatically after bonding, bonded product removed to plastic tray or production line manually, prepare for next step..
3. Machine Advantages:
1> The machine can achieve the station which requires higher level automation , improve yield, low demand for operator experience.
2> Bonding efficiency 2 times higher compared to manual machines, saving manpower
3> Good stability: the machine adopts the most advanced domestic design concepts, core parts of the machine imported from Japan & South Korean, strictly QC testing action taken in the machining process to ensure equipment overall stability and life.