Semi Automatic Cog Main Bonding Machine
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Product Specifications
| Dimensions | 1200X800X1600Mm |
| Weight | 500Kg |
| Power | 220V |
| Material | Steel, Aluminum |
| Accuracy | ±0.01Mm |
| Speed | 1000 Units/Hour |
| Warranty | 1 Year |
| Features | High Accuracy, Easy Operation, High Stability, Durable Design, Automated Process, Precise Bonding, Cost Effective, Time Saving |
Product Overview
Key Features
1, Machine function description :
The equipment is a COG main-bonding machine i Chip on glassi ,it can satisfy high bonding accuracy in whole process of IC main-bonding on the product of ITO STN-LCDa COLOR STN-LCDa TFT-LCDa OLED-LCD .
2. Working Method:
1> LCD placed on alignment table manually and press vacuum & start button.
2>The machine will conduct product main-bonding automatically.
3> The machine shut down vacuum automatically after completion of bonding, bonded product removed to plastic tray or production line manually, prepare for next step..
3. Machine Advantages:
1> Good equipment stability, high accuracy, low demand for operator experiencea
2> Good stability: the machine adopts the most advanced domestic design concepts, core parts of the machine imported from Japan & South Korean, strictly QC testing action taken in the machining process to ensure equipment overall stability and life.
Company Details
Focusing on a customer-centric approach, Shenzhen Liande Automation Equipment Co., Ltd has a pan-India presence and caters to a huge consumer base throughout the country. Buy Industrial Machinery & Parts in bulk from Shenzhen Liande Automation Equipment Co., Ltd at Trade India quality-assured products.
Business Type
Exporter, Manufacturer, Distributor, Supplier, Trading Company
Establishment
1998
Working Days
Monday To Sunday
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Seller Details
Shenzhen, Guangdong
Mr. David Zhang
Address
Factory add: Tongfucun Industrial Park, Dalang Street, Bao'an District, Shenzhen, Guangdong, 518109, China
bonding machine in Shenzhen
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