Semi Automatic Cog Main Bonding Machine

We are leading voice for producing and exporting of Semi Automatic COG Main Bonding Machine with the following details:
1, Machine function description :
The equipment is a COG main-bonding machine i Chip on glassi ,it can satisfy high bonding accuracy in whole process of IC main-bonding on the product of ITO STN-LCDa COLOR STN-LCDa TFT-LCDa OLED-LCD .
2. Working Method:
1> LCD placed on alignment table manually and press vacuum & start button.
2>The machine will conduct product main-bonding automatically.
3> The machine shut down vacuum automatically after completion of bonding, bonded product removed to plastic tray or production line manually, prepare for next step..
3. Machine Advantages:
1> Good equipment stability, high accuracy, low demand for operator experiencea
2> Good stability: the machine adopts the most advanced domestic design concepts, core parts of the machine imported from Japan & South Korean, strictly QC testing action taken in the machining process to ensure equipment overall stability and life.