Lead Free Solder Paste Ky805a

Our range of Lead Free Solder Paste KY805A is no-clean solder paste which use in SMT production processing.It is designed with the compound of low oxide contained spherical alloy solder powder and special solder paste and has good printability, Moreover,in order to reach the excellent insulation and residual resistance and make sure the reliability of the"No-clean"efficiency after back welding our product is specially designed with the high reliability low ionic activator system.In order to match different production processing requirement we could adjust the quantity of the alloy,powder and other metallic materials.

Specification
Testing standard and methods:ANSI/J-STD-004/005/006;ISZ 3283-86;PC-TM-650
Composition analysis
1.Tin(Sn)%:99A 0.5
2.Silver(Ag)%:0.3A 0.05
3.Copper(Cu)%:0.7A 0.02
4.Lead(Pb)%:a 0.10
5.Stibium(Sb)%:a 0.02
6.Bismuth(Bi)%:a 0.10
7.Steal(Fe)%:a 0.02
8.Arsenic(As)%:a 0.03
9.Zinc(Zn)%:a 0.002
10.Aluminum(Al)%:a 0.002
11.Cadmium(Cd)%:a 0.002
12.Nickel(Ni)%:a 0.005
Notes:All the above metallic material quantity of the alloy solder powder could be check in quanlity inspection document and accord with J-STD-00 standard.

Alloy physical properties
1.Melting point:217~218 a
2.Alloy specific gavity:7.4g/cm3
3.Hardness:15HB
4.Thermal conductivity:64J/M.S.K
5.Tensile strength:52Mpa
6.Elongation:27%
7.Conductivity:14% of LACS