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Cog Bonding Machine - Electric Motor Positioning System, 7-inch Touch Screen Interface, Reversible Pressure Head Design, High-precision Three-axis Control

Cog Bonding Machine - Electric Motor Positioning System, 7-inch Touch Screen Interface, Reversible Pressure Head Design, High-precision Three-axis Control

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Product Specifications

Accuracy0.01Mm
DimensionsCustomizable
FeaturesPrecise Positioning, Intuitive Interface, Efficient Bonding, Versatile Design, High Precision, Reduced Gas Use, Easy Operation
MaterialAluminum
Power220V
PressureAdjustable
Screen Size7 Inch
Weight100Kg

Product Overview

Key Features

The COG Bonding Machine is used for aligning and bonding IC driver to various LCD glasses.

Key Features:
Positioning pressure head adopt electric motor, and self-gravity up-down design avoid the offset and fake press because of excessive pressure and inaccurate route of cylinder and electronic motor.
Positioning system combines the companya s self-developed image processor and PLC programme. It makes the operation more convenient, intuitive and accurate.
The operating interface adopt 7 inches full-colourful touch screen that can store multiple sets of product parameters to facilitate the production of call.
External vacuum system greatly reduced the gas consumption, apply to small factoriesa product maintenance and batch product.
Unique reversible pressure head design, suitable for all kinds of IC bonding.
High-precision three-axis micrometer supplement with CCD and coaxial lens of monitor imaging.

Company Details

Established in 2006, SHENZHEN SUNSOM AUTOMATION EQUIPMENT CO. LTD. has made a name for itself in the list of top suppliers of Machineries in India. The supplier company is located in Shenzhen, Guangdong, and is one of the leading sellers of listed products.
SHENZHEN SUNSOM AUTOMATION EQUIPMENT CO. LTD. is listed in Trade India's list of verified sellers offering supreme quality of Automatic Bubble Removing Machine, Bonding Machine, COG Bonding Machine, etc. Buy Machineries in bulk from us for the best quality products and service.

Business Type

Exporter, Manufacturer

Establishment

2006

Working Days

To

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Seller Details

Shenzhen, Guangdong

Name

Mr. Michael

Address

4F, Block C, Liyue Industrial Park, Fenghuang, Fuyong, Baoan, Shenzhen, Guangdong, 518103, China

bonding machine in Shenzhen

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Response Rate

100

Price Or Price Range

400000 INR (Approx.)

1500-1800 USD ($) (Approx.)

Minimum Order Quantity

1 Set/Sets

1 Set/Sets

Application

Automatic Prebonding 4K panel BIG COF OLD COF Special Modeall types of lcd panel cof ( Chip On Film ) replacement

Mainly used for evenly coating materials of EPE, sponge, EVA, EPP, cardboard etc., bond together.

Color

Grey

Blue

Weight

370 Kilograms (kg)

100 Kilograms (kg)

Condition

New

New

FOB Port

rajkot

Zhuhai

Payment Terms

Cash Advance (CA), Cheque

Telegraphic Transfer (T/T)

Supply Ability

25 Per Month

100 Per Month

Delivery Time

10 Days

10 Days

Packaging Details

wooden box packing

Protective materials and wooden case

Main Export Market(s)

Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

Asia, Australia, Central America, South America, Middle East, Africa

Main Domestic Market

All India

All India