Bonding Machine In Huizhou

MOQ1 Meter

Materialepe sheet

ComputerizedYes

Product Descriptionkeeping in mind ever twisting requirement of customer, we are indulged in exporting, manufacturing, distributing, supplying and trading of epe foam sheet bonding/thickening machine in Huizhou, Guangdong, China. EPE foam sheet bonding machine is also called epe foam sheet thickening machine. It is la

MOQ1 Set/Sets

Operating TypeAutomatic

Power4500 Watt (w)

Dimension(L*W*H)1100*1100*1800 Millimeter (mm)

MOQ1 Set/Sets

FOB PortShenzhen port

Payment TermsLetter of Credit (L/C), Paypal, Telegraphic Transfer (T/T), Cheque

Supply Ability500 Per Month

Product DescriptionWith the assistance and support of our highly experienced professionals we extend to our clients a well-tested range of Bonding Sponge Peeling Machine (Model AV-907B). This range of machines is designed and developed by skilled and dedicated team of professional. We provide these at most competitive

Product DescriptionAuto Module Bonding Machine Range of Application The machine is for the connecting of copper wire antenna with the module in the production of RFID card. Working principle X axis take the bonding on direction of left and right moving. Y axis take the bonding on direction of front and back

Product DescriptionWe are instrumental in providing to our valuable customers excellent quality Spunbond Net For Spunbond Machine which is available with following specification:- Warp diameter(mm) : 0.344*0.52 Weft diameter(mm) : 0.6 Warp density (threads/cm) : 20 Weft density (threads/cm) : 10.5 Thickness (mm) : 1.5

MOQ1 Piece/Pieces

UsageIndustrial

Product TypeWire Bonding Plasma Cleaner Machine

MaterialOther

MOQ10000 Piece/Pieces

FOB PortShenzhen

Payment TermsLetter of Credit (L/C), Cash on Delivery (COD), Cash Against Delivery (CAD), Cash Advance (CA), Cash in Advance (CID)

Supply AbilityAs per requirement Per Week

MOQ1 Set/Sets

ComputerizedYes

Automatic GradeAutomatic

Control SystemPLC Control

Product DescriptionThe Bonding Machine is used for aligning and bonding IC driver to various LCD glasses. These Bonding Machines are manufactured from high grade quality raw materials. Our Bonding Machines can be customized as per our customers specifications and it can be availed at industrial leading price

Product DescriptionWe are leading voice for exporting and producing of Semi Automatic COG Pre Bonding Machine with the following details: 1, Machine function description : The equipment is a semi-automatic COG pre-bonding machine Chip on glass,it can satisfy high bonding accuracy in whole process of IC pre-alignment o