ApplicationCopper plating
FeaturesHigh purity Regular dissolution Low mud formation Consistent quality Easy to use Cost effective Durable Reliable
MaterialCopper
Packaging25kg/box50kg/barrel
Phosphorus content0.04-0.06%
Purity99%
Base MaterialCopper (T1T2)
CoatingTi Zr Ni
DimensionsVariable
FeaturesCorrosion resistance High conductivity Long lifespan Superior strength Anode application
MaterialTitanium-clad copper
ShapeRectangular
MaterialCoppertungsten
ConditionNew
TechnologyOther
PortableNo
Light SourceNo
Operating Temperature2000 Celsius (oC)
ApplicationPCB Industry
DiameterVarious
FeaturesHigh purity Consistent quality Cost effective Long lasting Easy to use Widely applicable Excellent performance
MaterialCopper
PackagingCartons
Purity99.9%
DimensionsVaried
FeaturesHigh Purity Fine Grain Even Distribution Residue Free PCB Grade Plating Grade High Quality CDA Standard
Lead0.0006%max
MaterialCopper Phosphorous
Other ImpuritiesMultiple
Phosphorous0.0524%
DimensionsVaried
FeaturesHigh Strength Corrosion Resistant Long Lasting Versatile Use Industrial Grade High Conductivity Easy to Install
Manufacturing ProcessPrecision Casting
MaterialTitanium Copper
PurityHigh
Surface FinishSmooth
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