CapacityLarge
DimensionsLarge
FeaturesHigh efficiency Low cost Precise cutting Stable operation Process solidification Ultra-thin wafer Ultra-fine wire
MaterialSteel
PowerHigh
PrecisionHigh
Dimensions5000x2000x2500mm
FeaturesHigh Efficiency Low Cost Precise Cutting Stable Operation Process Solidification
MaterialSteel
Power100KW
Precision0.01mm
UsageCutting silicon wafers; polysilicon monocrystalline silicon and other silicon materials.
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