Ultrasonic Gold Wire Ball Bonding Machine - 700x460x550mm, 3w Ultrasonic Power, 60-400°c Welding Temperature, Manual Operation, 150kg/day Production Capacity, 0-100ms Adjustable Welding Time, 20-50µm Wire Diameter

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Gold wire ball bonding machine (high power gold wire ball bonding machine) description: ultrasonic gold wire ball bonding machine product use gold wire ball bonding machine is mainly used in high-power light emitting diode (LED), laser tube (laser), small and medium-sized power diode, transistor, integrated circuit, sensor and some special wire welding in semiconductor devices, especially for high-power light-emitting tube welding.
Technical Parameters:
a Applicable gold wire diameter: 20i 50I m (0.8i 2 mil)
a Welding temperature: 60 ~ 400 A C
a Ultrasonic power: four channels 0~3 W are continuously adjustable in two stage
a Welding time: two channels 0~100ms
a Welding pressure: two channels 35 ~ 180g
a The maximum automatic span from one welding to two welding: no less than 4mm in both directions
a Length of tail wire: 0~2mm
a Gold ball size: 2 to 4 times the wire diameter can be set arbitrarily
a Minimum welding time: 0.4s/line
a Fixture movement range: I 25mm
a Vision system: optional stereo microscope and image monitor
a Dimensions: 700 (length) A 460 (width) A 550 (height)