Semiconductor Wafer Dincing Ring Frame

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Minimum Order Quantity :

In Stock

Product Specifications

Usage	Supports wafer integrity in semiconductor manufacturing
Interface	Wafer chucks, tape handling systems
Features	Corrosion resistance, high dimensional accuracy, robust construction
Thermal Conductivity	High (metal frame)
Operating Temperature	-10C to 150C (typical)
Components	Frame body
Product Type	Wafer Dicing Ring Frame
Application	Semiconductor wafer dicing and processing
Size	Standard wafer sizes (6 inch, 8 inch, 12 inch, custom)
Dimension (LWH)	Dimension matches wafer size; typical OD: 8-13 inches
Function	Holder for semiconductor wafer during dicing process
Color	Metallic Silver / Gray
Weight	Lightweight (<50g, typical)
Thickness	Typically 0.5 mm to 1 mm
Capacity	Single wafer support per frame
Payment Terms	Cash in Advance (CID)
Supply Ability	500 Per Month
Delivery Time	2-5 Days
Main Export Market(s)	Asia

Company Details

Business Type

Exporter, Manufacturer, Supplier

Employee Count

Establishment

1985

Working Days

Monday To Friday

Payment Mode

Online Payments (NEFT/RTGS/IMPS), Cheque/DD

Certification

ISO 45001 & 14001 Certified、BSI 9001

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Seller Details

Yj Stainless Ltd

TrustedSeller

Taoyuan, Taoyuan

Project Manager

Mr Ken Huang

Members since

1 Years

Address

NO.1023, Yong-an Rd Taoyuan, Taoyuan, 330, Taiwan

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Compare With Similar Products

Product Name

Semiconductor Wafer dincing ring Frame

Solid Dielectric Cell

TRJK0071CNL Connector

Response Rate

100

Minimum Order Quantity

10 Piece/Pieces

1 Unit/Units

Usage

Supports wafer integrity in semiconductor manufacturing

measurement of dielectric constant

Interface

Wafer chucks, tape handling systems

Clamp/terminal connections

Features

Corrosion resistance, high dimensional accuracy, robust construction

High dielectric strength, precision electrodes, suitable for laboratory dielectric loss and insulation measurements

Thermal Conductivity

High (metal frame)

Low, suitable for insulation

Operating Temperature

-10C to 150C (typical)

0AdegC to 50AdegC

Components

Frame body

Solid dielectric material, metal electrodes, terminals

Product Type

Wafer Dicing Ring Frame

Solid Dielectric Cell

TRJK0071CNL Connector

Application

Semiconductor wafer dicing and processing

Electrical insulation testing, laboratory use

Size

Standard wafer sizes (6 inch, 8 inch, 12 inch, custom)

Standard laboratory size

Dimension (L*W*H)

Dimension matches wafer size; typical OD: 8-13 inches

240 mm x 150 mm x 100 mm (approx)

Function

Holder for semiconductor wafer during dicing process

Insulation and high-voltage testing

Color

Metallic Silver / Gray

Grey

Weight

Lightweight (<50g, typical)

Approx 3-5 kg

Thickness

Typically 0.5 mm to 1 mm

10-25 mm

Capacity

Single wafer support per frame

Typically ranges from 100 pF to 500 pF

Payment Terms

Cash in Advance (CID)

Paypal, Telegraphic Transfer (T/T)

Supply Ability

500 Per Month

50000000 Per Month

Delivery Time

2-5 Days

7-10 Days

4 Week

Main Export Market(s)

Asia

Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

Sold By

Yj Stainless Ltd
Taoyuan, Taoyuan

Vidyut Yantra Udyog
Modinagar, Uttar Pradesh

Trxcom Int'l Technology Co., Ltd.
Shenzhen, Guangdong