Semiconductor Wafer Dincing Ring Frame

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Minimum Order Quantity :

In Stock

Product Specifications

Components	Frame body
Features	Corrosion resistance, high dimensional accuracy, robust construction
Operating Temperature	-10C to 150C (typical)
Usage	Supports wafer integrity in semiconductor manufacturing
Interface	Wafer chucks, tape handling systems
Thermal Conductivity	High (metal frame)
Product Type	Wafer Dicing Ring Frame
Application	Semiconductor wafer dicing and processing
Size	Standard wafer sizes (6 inch, 8 inch, 12 inch, custom)
Dimension (LWH)	Dimension matches wafer size; typical OD: 8-13 inches
Function	Holder for semiconductor wafer during dicing process
Color	Metallic Silver / Gray
Weight	Lightweight (<50g, typical)
Capacity	Single wafer support per frame
Thickness	Typically 0.5 mm to 1 mm
Payment Terms	Cash in Advance (CID)
Supply Ability	500 Per Month
Delivery Time	2-5 Days
Main Export Market(s)	Asia

Company Details

Business Type

Exporter, Manufacturer, Supplier

Employee Count

Establishment

1985

Working Days

Monday To Friday

Payment Mode

Online Payments (NEFT/RTGS/IMPS), Cheque/DD

Certification

ISO 45001 & 14001 Certified、BSI 9001

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Seller Details

Yj Stainless Ltd

Taoyuan, Taoyuan

Project Manager

Mr Ken Huang

Members since

1 Years

Address

NO.1023, Yong-an Rd Taoyuan, Taoyuan, 330, Taiwan

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Compare With Similar Products

Product Name

Semiconductor Wafer dincing ring Frame

Solid Dielectric Cell

Nvidia Jetson Nano Developer Kit

Minimum Order Quantity

10 Piece/Pieces

1 Unit/Units

Components

Frame body

Solid dielectric material, metal electrodes, terminals

Features

Corrosion resistance, high dimensional accuracy, robust construction

High dielectric strength, precision electrodes, suitable for laboratory dielectric loss and insulation measurements

Operating Temperature

-10C to 150C (typical)

0AdegC to 50AdegC

Usage

Supports wafer integrity in semiconductor manufacturing

measurement of dielectric constant

Computer

Interface

Wafer chucks, tape handling systems

Clamp/terminal connections

Thermal Conductivity

High (metal frame)

Low, suitable for insulation

Product Type

Wafer Dicing Ring Frame

Solid Dielectric Cell

Nano Developer Kit

Application

Semiconductor wafer dicing and processing

Electrical insulation testing, laboratory use

Industrial

Size

Standard wafer sizes (6 inch, 8 inch, 12 inch, custom)

Standard laboratory size

Dimension (L*W*H)

Dimension matches wafer size; typical OD: 8-13 inches

240 mm x 150 mm x 100 mm (approx)

Function

Holder for semiconductor wafer during dicing process

Insulation and high-voltage testing

Color

Metallic Silver / Gray

Grey

Weight

Lightweight (<50g, typical)

Approx 3-5 kg

Capacity

Single wafer support per frame

Typically ranges from 100 pF to 500 pF

Thickness

Typically 0.5 mm to 1 mm

10-25 mm

Payment Terms

Cash in Advance (CID)

Supply Ability

500 Per Month

100 Per Month

Delivery Time

2-5 Days

7-10 Days

7 Days

Main Export Market(s)

Asia

Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

Power Supply

Not required (passive component)

Electric

Rated Voltage

Up to 33 kV

5 Volt (V)

Supply Voltage

Test supply voltage up to 33 kV

2.5 Ampere (amp)

Main Domestic Market

All India

Sold By

Yj Stainless Ltd
Taoyuan, Taoyuan

Vidyut Yantra Udyog
Modinagar, Uttar Pradesh

Krish Tec
Coimbatore, Tamil Nadu