Pcb Assembly - Advanced Smt & Thru-hole Solutions | Vision-aligned Solder Paste, High Velocity Hot Air Reflow, In-house Fpga Programming, Ipc-610 Class 3 Quality

Following are the Main Features of PCB Assembly :-
1, Vision aligned solder paste deposition
2, 0201 to uBGA SMT placement capability
3, Pin In Paste (Intrusive Reflow)
4, High velocity forced hot air reflow systems
5, Light-guided work stations for conventional 'thru-hole' PCB assembly
6, Latest dual wave, flow soldering equipment
7, Programmable Selective Soldering
8, Analogue, Digital, RF and Functional test development, operation and debug In house FPGA and EPROM programming
9 , Workmanship to IPC-610 class 3 or MIL STD 2000 equivalent
10, Assemble your printed circuit boards into finished product box assemblies
11, Provide cabinet, rack and backplane wired assemblies
12, Press-fit connectors into high density PCBs & Backplanes
13, Provide in house FPGA and EPROM programming facilities
14, Assemble complex cable forms & harnesses
15, Carry out potting, encapsulation and heat shrinking
16, Provide automated 'cut and strip' facilities to ensure accuracy of wire processing
17, Carry out semi-automated wire wrapping of complex assemblies
18, Provide service and repair facilities for product refurbishment and upgrade
19, Provide Functionality Testing,
20, Well package and storage and ready to ship