Multilayer By At&s India Pvt. Ltd.

HDI Microvia - FR4 Material, 4-18 Layers, 0.4-2.0mm Thickness, 0.2mm Drill Diameter | High Density, Versatile, Customizable

Photovoltaic Module - Silicon, 1000 x 1000 mm | 300W Power Output, 36V Voltage, 8.3A Current, 15 kg Weight, 10-Year Warranty

Flexible Circuit Boards - Polyimide/FR4 Stiffner, 1-10 Layers, >0.1mm Thickness, Minimum Drill Diameter 0.2mm, Features HDI Technology and Multiple Surface Finishes

Double Sided PCB's

Semi Flexible Circuit Boards - FR4 0.125mm Double Sided, 0.28mm Drill | Flexible, Durable, High Density, Chemical Nickel/Gold Surface

Multilayer

Rigid Flexible Circuit Boards - Polyimide/FR4, 0.6-2.00mm Thickness, 2-18 Layers | High Flexibility, 0.28mm Drill Diameter, Chemical Nickel/Gold Finish

Single Sided PCB's - FR4 Material, 0.8-2.0mm Thickness, 1oz Copper | UV Lacquer Solder Resist, HAL Surface, High Reliability, Customizable

IMS - Aluminium/Insulation/Copper, 1.5mm Core Thickness, 80-160 µm Isolation Thickness, 0.5-4 W/m/K Thermal Conductivity, 2-5 kV Dielectric Strength, UV Screen Printed Lacquer Finish, Chemical Nickel/Gold Coating