Die Bonders By N. M. Tronics India Pvt. Ltd.

We are a remarkable entity, engaged in Exporter, Manufacturer & Supplier of Die Bonders in Noida, Uttar Pradesh0, India, Our brand new Twin-Head Multi-Chip Die Bonder offers you two machines in just one compact module: a separate dispensing area with integrated dispenser and a bonding area for die attach and flip chip applications. Furthermore, the 2200 evo handles 300mm wafer magazines inside the machine on less than 1.5 square meters. The amazing performance of up to 7,000 UPH and a yield > 99.95 percent guarantee lowest cost of ownership and make Datacon's 2200 evo your ideal bonder for high end.