Laminated Bus Bar - Cu-etp Electrolytic Tough Pitch Copper, Multi-layer Design, Low Inductance & Partial Discharge Under 10 Pico Coulomb, Customized Geometries

Our firm have emerged as one of the most prominent names in the industry, engaged in manufacturing and supplying a comprehensive range of Bus Bar in Chennai, Tamil Nadu, India.

Various Types:

a. Laminated Bus bars

b. Powder coated Bus bars

c. Molded Bus bars

Description:
Power Electronics often requires very low inductive interconnections, especially in the medium-high power range. The most common solution to reach stray inductance values around some tens of Nano-henries and even below is to use a bus-bar structure. This "simple" assembly of copper sheets is intended to link several points of the structure, and to stay as Equi-potential as possible.

The role of a bus-bar is to link several points of a power electronics converter: capacitors, semiconductors and often to achieve series or parallel association of these devices.

Standards:
IEC 60601-1, ASTM D 1062, ANSI C37.20, BS159

Specialization

Laminated Bus bars:

a) Multi-Layer bus bar development

b) Low Inductance can be achieved

c) Low level of Partial Discharge can be achieved (less than 10Pico Coulomb)

d) Thermal Modelling of Bus bars

Geometries

Any Special Geometry

Conductor:

Cu-ETP Electrolytic tough pitch high conductivity copper CW004A (formerly C101 - (AS per JIS - C1100))

Cu-FRHC Fire-refined tough pitch high conductivity copper CW005A (formerly C102)

Cu-OF Oxygen-free high conductivity copper CW008A (formerly C103)